spec no: dsao4028 rev no: v.2b date: sep/02/2015 page: 1 of 6 approved: wynec checked: allen liu drawn: m.liu erp: 1203015039 1x1mm smd chip led lamp (0.2mm height) attention observe precautions for handling electrostatic discharge sensitive devices part number: APGF1011SEEPBVGC-TT green blue hyper-red features z 1.0mmx1.0mm smd led, 0.2mm thickness. z low power consumption. z package : 4000pcs / reel. z moisture sensitivity level : level 3. z low current if=5ma operating. z rohs compliant. descriptions z the green source color devices are made with ingan on sic substrate light emitting diode. z the blue source color devices are made with ingan on sic substrate light emitting diode. z the hyper-red source color devices are made with algainp on gaas subs trate light emitting diode. z electrostatic discharge and power surge could damage the leds. z it is recommended to use a wrist band or anti- electrostatic gl ove when handling the leds. z all devices, equipments and machineries must be electrically grounded. package dimensions notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.1(0.004") unless otherwise noted. 3. the specifications, characteristics and technical data descri bed in the datasheet are subject to change without prior notice . 4. the device has a single mounting surface. the devi ce must be mounted according to the specifications.
spec no: dsao4028 rev no: v.2b date: sep/02/2015 page: 2 of 6 approved: wynec checked: allen liu drawn: m.liu erp: 1203015039 selection guide notes: 1. 1/2 is the angle from optical centerline where the lumi nous intensity is 1/2 of the optical peak value. 2. luminous intensity / luminous flux: +/-15%. 3. luminous intensity value is traceable to the cie127-2007 compliant national standards. absolute maximum ratings at ta=25c electrical / optical characteristics at ta=25c notes: 1. wavelength: +/-1nm. 2. forward voltage: +/-0.1v. 3. wavelength value is traceable to the cie127-2007 compliant national standards. 4. excess driving current and/or operating temperature higher t han recommended conditions may result in severe light degradatio n or premature failure. part no. emitting color (material) lens type iv (mcd) [2] @ 5ma v iewing angle [1] typ. 2 1/2 g b APGF1011SEEPBVGC-TT green (ingan) water clear 50 80 150 150 blue (ingan) 10 23 hyper-red (algainp) 15 30 min. r 130 symbol parameter emitting color typ. max. units test conditions peak peak wavelength green blue hyper-red 518 461 632 nm i f =5ma d [1] dominant wavelength green blue hyper-red 527 467 624 nm i f =5ma ? 1/2 spectral line half-width green blue hyper-red 35 22 20 nm i f =5ma c capacitance green blue hyper-red 100 110 25 pf v f =0v;f=1mhz v f [2] forward voltage green blue hyper-red 3 2.9 1.95 3.2 3.1 2.3 v i f =5ma i r reverse current green blue hyper-red 50 50 10 ua v r =5v parameter green blue hyper-red units power dissipation [1] mw dc forward current [2] 10 10 10 ma peak forward current [3] 50 50 50 ma reverse voltage 5 v operating temperature -40c to +85c storage temperature -40c to +100c 35 electrostatic dischar ge threshold (hbm) 1000 1000 3000 v notes: 1.within 35mw when multiple chips are lightened 2.the maximum ratings are valid for the case of lighting a single chip when two chips are lit at the same time, each chip should be dr iven at a current lower than 50% of the absolute maximum ratings when three chips are lit at the same time, each chip should be driven at a current lower than 30% of the absolute maximum ratin gs 3.duty cycle 1/20, pulse width=1ms.
spec no: dsao4028 rev no: v.2b date: sep/02/2015 page: 3 of 6 approved: wynec checked: allen liu drawn: m.liu erp: 1203015039 APGF1011SEEPBVGC-TT green
spec no: dsao4028 rev no: v.2b date: sep/02/2015 page: 4 of 6 approved: wynec checked: allen liu drawn: m.liu erp: 1203015039 hyper-red blue
spec no: dsao4028 rev no: v.2b date: sep/02/2015 page: 5 of 6 approved: wynec checked: allen liu drawn: m.liu erp: 1203015039 APGF1011SEEPBVGC-TT reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product. recommended soldering pattern (units : mm; tolerance: 0.1) reel dimension tape dimensions (units : mm)
spec no: dsao4028 rev no: v.2b date: sep/02/2015 page: 6 of 6 approved: wynec checked: allen liu drawn: m.liu erp: 1203015039 packing & label specifications APGF1011SEEPBVGC-TT terms and conditions for the usage of this document 1. the information included in this docum ent reflects representative usage scenarios and is intended for technical reference on ly. 2. the part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. before production usage customer should refer to the latest datasheet for the updated specifications. 3. when using the products referenced in this document, please make sure the produc t is being operated within the environmental and electrical limits specified in the dat asheet. if customer usage exceeds the spec ified limits, kingbright will not be respon sible for any subsequent issues. 4. the information in this document applies to typical usage in consumer electronics applicati ons. if customer's application ha s special reliability requirements or have life-threatening liabilitie s, such as automotive or m edical usage, please consult with kingbright representative for further assistance. 5. the contents and information of this document may not be reproduced or re-transmitted without permission by kingbright. 6. all design applications should refer to kingbright application notes available at http://www.kingbrightusa.com/applicationnotes
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